3.現(xiàn)代交流伺服系統(tǒng),在經(jīng)歷了從模擬到數(shù)字化的轉(zhuǎn)變后,其內(nèi)部數(shù)字控制環(huán)已經(jīng)無處不在,比如換相、電流、速度和位置控制等;其實(shí)現(xiàn)主要通過功率半導(dǎo)體器件,像高性能DSP加FPGA、甚至伺服專用模塊也不足為奇。且新的功率器件或模塊每2~2.5年就會(huì)更新一次,新的軟件算法也日新月異,廠商的伺服產(chǎn)品大概每5年亦會(huì)更新?lián)Q代——總而言之,產(chǎn)品生命周期越來越短,變化越來越快??偨Y(jié)伺服廠家的技術(shù)路線和產(chǎn)品路線,結(jié)合市場需求的變化,可以看到以下一些伺服電機(jī)系統(tǒng)的發(fā)展趨勢:
率化
盡管化一直都是伺服系統(tǒng)重要的發(fā)展課題,但是仍需要繼續(xù)加強(qiáng)。主要包括電機(jī)本身的率:比如永磁材料性能的改進(jìn)和更好的磁鐵安裝結(jié)構(gòu)設(shè)計(jì);也包括驅(qū)動(dòng)系統(tǒng)的率化:包括逆變器驅(qū)動(dòng)電路的優(yōu)化,加減速運(yùn)動(dòng)的優(yōu)化,再生制動(dòng)和能量反饋以及更好的冷卻方式等。
新聞:韶關(guān)3D打印機(jī)用步進(jìn)馬達(dá)57H56-0804團(tuán)購
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