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寰峰湅Behlke HTS 60-100-SCR
寰峰湅Behlke HTS 60-200-SCR
寰峰湅Behlke HTS 120-100-SCR
寰峰湅Behlke HTS 40-1000-SCR
寰峰湅Behlke HTS 80-200-SCR
寰峰湅Behlke HTS 80-500-SCR
寰峰湅Behlke HTS 160-200-SCR
寰峰湅Behlke HTS 150-200-SCR
寰峰湅Behlke HTS 300-100-SCR
寰峰湅Behlke HTS 60-1000-SCR
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Switch Model [sorted by voltage] |
Debion / Comment |
Max. Voltage |
Peak Current |
Peak Power |
On- Time |
Housing Dimensions |
Drawing (PDF) |
|
HTS 40-1000-SCR | 鈼� | Sync. I/O for parallel connection. |
4
|
10000
|
40
|
35鈥︹垶
|
89 x 64 x 31
|
request |
HTS 60-1000-SCR | 鈼� | Sync. I/O for parallel connection. |
6
|
10000
|
60
|
35鈥︹垶
|
122 x 64 x 31
|
request |
HTS 60-100-SCR | 鈼� | Tubular housing with HV pigtails. Cooling options not available. |
6.4
|
1000
|
6.4
|
35鈥︹垶
|
135 x 20 x 20
|
request |
HTS 60-200-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
6.4
|
2000
|
12.8
|
35鈥︹垶
|
80 x 38 x 25
|
|
HTS 80-200-SCR | 鈼� | Sync. I/O for parallel connection. |
8
|
2000
|
16
|
35鈥︹垶
|
89 x 64 x 31
|
request |
HTS 80-500-SCR | 鈼� | Sync. I/O for parallel connection. |
8
|
5000
|
40
|
35鈥︹垶
|
89 x 64 x 31
|
|
HTS 80-1000-SCR | 鈼� | Sync. I/O for parallel connection. |
8
|
10000
|
80
|
35鈥︹垶
|
153 x 64 x 31
|
|
HTS 100-1600-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
10
|
16000
|
160
|
35鈥︹垶
|
179 x 103 x 35
|
request |
HTS 120-200-SCR | 鈼� | Sync. I/O for parallel connection. |
12
|
2000
|
24
|
35鈥︹垶
|
122 x 64 x 31
|
request |
HTS 120-500-SCR | 鈼� | Sync. I/O for parallel connection. |
12
|
5000
|
60
|
35鈥︹垶
|
122 x 64 x 31
|
|
HTS 120-1600-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
12
|
16000
|
192
|
35鈥︹垶
|
204 x 103 x 35
|
request |
HTS 120-100-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
12.8
|
1000
|
12.8
|
35鈥︹垶
|
80 x 38 x 25
|
|
HTS 150-200-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
15
|
2000
|
30
|
35鈥︹垶
|
103 x 70 x 35
|
request |
HTS 160-200-SCR | 鈼� | Sync. I/O for parallel connection. HV connection by pigtails only. |
16
|
2000
|
32
|
35鈥︹垶
|
89 x 64 x 31
|
request |
HTS 160-500-SCR | 鈼� | Sync. I/O for parallel connection. |
16
|
5000
|
80
|
35鈥︹垶
|
153 x 64 x 31
|
|
HTS 160-200-SCR | 鈼� | Sync. I/O for parallel connection. |
16
|
2000
|
32
|
35鈥︹垶
|
153 x 64 x 31
|
request |
HTS 160-1600-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
16
|
16000
|
256
|
35鈥︹垶
|
253 x 103 x 35
|
request |
HTS 200-800-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
20
|
8000
|
160
|
35鈥︹垶
|
179 x 103 x 35
|
request |
HTS 220-800-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
22
|
8000
|
176
|
35鈥︹垶
|
179 x 103 x 35
|
request |
HTS 220-1000-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
22
|
10000
|
220
|
35鈥︹垶
|
252 x 150 x 40
|
request |
HTS 220-1200-SCR | 鈼� | LED's, Sync. I/O, housing style as before, but with separate control unit |
22
|
12000
|
264
|
35鈥︹垶
|
160 x 150 x 30
|
|
HTS 240-100-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
24
|
1000
|
24
|
35鈥︹垶
|
103 x 70 x 35
|
|
HTS 240-800-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
24
|
8000
|
192
|
35鈥︹垶
|
204 x 103 x 35
|
request |
HTS 240-1000-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
24
|
10000
|
240
|
35鈥︹垶
|
252 x 150 x 40
|
request |
HTS 240-1200-SCR | 鈼� | LED's, Sync. I/O, housing style as before, but with separate control unit |
24
|
12000
|
288
|
35鈥︹垶
|
160 x 150 x 30
|
request |
HTS 300-100-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
30
|
1000
|
30
|
35鈥︹垶
|
103 x 70 x 35
|
request |
HTS 320-200-SCR | 鈼� | Sync. I/O for parallel connection. HV connection by pigtails only. |
32
|
2000
|
64
|
35鈥︹垶
|
153 x 64 x 31
|
request |
HTS 320-800-SCR | 鈼� | LED indicators & Sync. I/O for parallel connection |
32
|
8000
|
256
|
35鈥︹垶
|
253 x 103 x 35
|
request |
HTS 320-200-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
32
|
2000
|
64
|
35鈥︹垶
|
206 x 70 x 35
|
request |
HTS 350-800-SCR | 鈼� | With LED indicators, enlarged housing, many options simultaneously integratable | 35 | 8000 | 280 | 35鈥︹垶 | 372 x 200 x 43 | request |
HTS 400-200-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
40
|
2000
|
80
|
35鈥︹垶
|
312 x 120 x 38
|
request |
HTS 440-1200-SCR | 鈼� | Sync. I/O for parallel connection, separate control unit |
44
|
12000
|
528
|
35鈥︹垶
|
312 x 200 x 45
|
request |
HTS 500-1200-SCR | 鈼� | Sync. I/O for parallel connection, separate control unit | 50 | 12000 | 600 | 35鈥︹垶 | 372 x 200 x 50 | request |
HTS 600-200-SCR | 鈼� | With LED indicators. HV connection by pigtails only. |
60
|
2000
|
120
|
35鈥︹垶
|
372 x 120 x 50
|
request |
HTS 640-100-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
64
|
1000
|
64
|
35鈥︹垶
|
206 x 70 x 35
|
request |
HTS 800-100-SCR | 鈼� | LED indicators. Very compact design - CF options partly not applicable! |
80
|
1000
|
80
|
35鈥︹垶
|
312 x 120 x 38
|
|
HTS 1200-100-SCR | 鈼� | With LED indicators. HV connection by pigtails only. |
120
|
1000
|
120
|
35鈥︹垶
|
372 x 120 x 50
|
request |
HTS 1200-2400-SCR | 鈼� | Flange or tubular housing. External control unit. |
120
|
24000
|
2880
|
35鈥︹垶
|
672 x 400 x 68
|
request |
HTS 1500-1000-SCR | 鈼� | Sync. I/O for parallel connection, separate control unit | 150 | 10000 | 1500 | 35鈥︹垶 | on request | request |
Options (1) |
|
|
|
HFB |
High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 渭s spacing are generated. |
HFS |
High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified 鈥淢aximum Operating Frequency鈥� shall be exceeded.(2) |
LP |
Low Pass: Low pass filter at the control b. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3) |
ST |
Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo). |
ISO-25 |
25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
ISO-40 |
40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
ISO-80 |
80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
ISO-120 |
120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
I-PC |
Integrated Part Components: Integration of small part components according to customer鈥檚 specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers).(2) |
I-FWD |
Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
LS-C |
LEMO socket for Control Connection: Input Z=100惟. An assembled bage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3) |
PT-C |
Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins, which must be replaced by pigtails in case of any cooling option except option ITC. |
PIN-C |
Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard. |
PT-HV |
Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits. |
ST-HV |
Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
SEP-C |
Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails. |
FOI-C |
Fibre Optics Input / Control: Additional optical control b to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2) |
FOO-F |
Fibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2) |
UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
FH | Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested. |
TH |
Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
FC |
Flat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with cooling options CF, GCF and DLC. |
ITC |
Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
CF |
Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
CF-1 |
Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
CF-X2 |
Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling. |
CF-X3 |
Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling. |
CF-CS |
Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power. |
CF-LC |
Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S. |
CF-D |
Double Copper Cooling Fins: Approx. more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS. |
CF-S |
Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS. |
CF-GRA |
Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm. |
CF-CER |
Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
CCS |
Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
CCF |
Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated bl frame for unib and safe contact pressure. Max. 40 kVDC isolation. |
C-DR |
Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
GCF |
Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance. In combination with option SPT-C only. |
GCF-X2 |
Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance 鈥淪witch to Flange鈥� reduced for twice the power capability. (2) |
ILC |
Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
DLC |
Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
HI-REL |
High Reliability / MIL Versions: Available on request. (2) |