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    HTS鍏ㄧ郴鍒�

    寰峰湅Behlke     HTS 60-100-SCR

    寰峰湅Behlke     HTS 60-200-SCR

    寰峰湅Behlke     HTS 120-100-SCR

    寰峰湅Behlke     HTS 40-1000-SCR

    寰峰湅Behlke     HTS 80-200-SCR

    寰峰湅Behlke     HTS 80-500-SCR

    寰峰湅Behlke     HTS 160-200-SCR

    寰峰湅Behlke     HTS 150-200-SCR

    寰峰湅Behlke     HTS 300-100-SCR

    寰峰湅Behlke     HTS 60-1000-SCR

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    Switch Model
    [sorted by voltage]

    Debion / Comment
    鈼� Preferred stock type 鈼� Lead time > 6 weeks  X Not for new development

    Max. Voltage
    [kV]

    Peak Current
    [A]

    Peak Power
    [MW]

    On-   Time
    [渭s]

    Housing Dimensions
    [mm3]

    Drawing
    (PDF)
    HTS 40-1000-SCR 鈼� Sync. I/O for parallel connection.
    4
    10000
    40
    35鈥︹垶
    89 x 64 x 31
    request
    HTS 60-1000-SCR 鈼� Sync. I/O for parallel connection.
    6
    10000
    60
    35鈥︹垶
    122 x 64 x 31
    request
    HTS 60-100-SCR 鈼� Tubular housing with HV pigtails. Cooling options not available.
    6.4
    1000
    6.4
    35鈥︹垶
    135 x 20 x 20
    request
    HTS 60-200-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    6.4
    2000
    12.8
    35鈥︹垶
    80 x 38 x 25
    PDF
    HTS 80-200-SCR 鈼� Sync. I/O for parallel connection.
    8
    2000
    16
    35鈥︹垶
    89 x 64 x 31
    request
    HTS 80-500-SCR 鈼� Sync. I/O for parallel connection.
    8
    5000
    40
    35鈥︹垶
    89 x 64 x 31
    PDF
    HTS 80-1000-SCR 鈼� Sync. I/O for parallel connection.
    8
    10000
    80
    35鈥︹垶
    153 x 64 x 31
    PDF
    HTS 100-1600-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    10
    16000
    160
    35鈥︹垶
    179 x 103 x 35
    request
    HTS 120-200-SCR 鈼� Sync. I/O for parallel connection.
    12
    2000
    24
    35鈥︹垶
    122 x 64 x 31
    request
    HTS 120-500-SCR 鈼� Sync. I/O for parallel connection.
    12
    5000
    60
    35鈥︹垶
    122 x 64 x 31
    PDF
    HTS 120-1600-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    12
    16000
    192
    35鈥︹垶
    204 x 103 x 35
    request
    HTS 120-100-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    12.8
    1000
    12.8
    35鈥︹垶
    80 x 38 x 25
    PDF
    HTS 150-200-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    15
    2000
    30
    35鈥︹垶
    103 x 70 x 35
    request
    HTS 160-200-SCR 鈼� Sync. I/O for parallel connection. HV connection by pigtails only.
    16
    2000
    32
    35鈥︹垶
    89 x 64 x 31
    request
    HTS 160-500-SCR 鈼� Sync. I/O for parallel connection.
    16
    5000
    80
    35鈥︹垶
    153 x 64 x 31
    PDF
    HTS 160-200-SCR 鈼� Sync. I/O for parallel connection.
    16
    2000
    32
    35鈥︹垶
    153 x 64 x 31
    request
    HTS 160-1600-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    16
    16000
    256
    35鈥︹垶
    253 x 103 x 35
    request
    HTS 200-800-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    20
    8000
    160
    35鈥︹垶
    179 x 103 x 35
    request
    HTS 220-800-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    22
    8000
    176
    35鈥︹垶
    179 x 103 x 35
    request
    HTS 220-1000-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    22
    10000
    220
    35鈥︹垶
    252 x 150 x 40
    request
    HTS 220-1200-SCR 鈼� LED's, Sync. I/O,  housing style as before, but with separate control unit
    22
    12000
    264
    35鈥︹垶
    160 x 150 x 30
    PDF
    HTS 240-100-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    24
    1000
    24
    35鈥︹垶
    103 x 70 x 35
    PDF
    HTS 240-800-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    24
    8000
    192
    35鈥︹垶
    204 x 103 x 35
    request
    HTS 240-1000-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    24
    10000
    240
    35鈥︹垶
    252 x 150 x 40
    request
    HTS 240-1200-SCR 鈼� LED's, Sync. I/O,  housing style as before, but with separate control unit
    24
    12000
    288
    35鈥︹垶
    160 x 150 x 30
    request
    HTS 300-100-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    30
    1000
    30
    35鈥︹垶
    103 x 70 x 35
    request
    HTS 320-200-SCR 鈼� Sync. I/O for parallel connection. HV connection by pigtails only.
    32
    2000
    64
    35鈥︹垶
    153 x 64 x 31
    request
    HTS 320-800-SCR 鈼� LED indicators & Sync. I/O for parallel connection
    32
    8000
    256
    35鈥︹垶
    253 x 103 x 35
    request
    HTS 320-200-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    32
    2000
    64
    35鈥︹垶
    206 x 70 x 35
    request
    HTS 350-800-SCR 鈼� With LED indicators, enlarged housing, many options simultaneously integratable 35 8000 280 35鈥︹垶 372 x 200 x 43 request
    HTS 400-200-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    40
    2000
    80
    35鈥︹垶
    312 x 120 x 38
    request
    HTS 440-1200-SCR 鈼� Sync. I/O for parallel connection, separate control unit
    44
    12000
    528
    35鈥︹垶
    312 x 200 x 45
    request
    HTS 500-1200-SCR 鈼� Sync. I/O for parallel connection, separate control unit 50 12000 600 35鈥︹垶 372 x 200 x 50 request
    HTS 600-200-SCR 鈼� With LED indicators. HV connection by pigtails only.
    60
    2000
    120
    35鈥︹垶
    372 x 120 x 50
    request
    HTS 640-100-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    64
    1000
    64
    35鈥︹垶
    206 x 70 x 35
    request
    HTS 800-100-SCR 鈼� LED indicators. Very compact design - CF options partly not applicable!
    80
    1000
    80
    35鈥︹垶
    312 x 120 x 38
    PDF
    HTS 1200-100-SCR 鈼� With LED indicators. HV connection by pigtails only.
    120
    1000
    120
    35鈥︹垶
    372 x 120 x 50
    request
    HTS 1200-2400-SCR 鈼� Flange or tubular housing. External control unit.
    120
    24000
    2880
    35鈥︹垶
    672 x 400 x 68
    request
    HTS 1500-1000-SCR 鈼� Sync. I/O for parallel connection, separate control unit 150 10000 1500 35鈥︹垶 on request request

    Options (1)



    HFB

    High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 渭s spacing are generated.

    HFS

    High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified 鈥淢aximum Operating Frequency鈥� shall be exceeded.(2)

    LP

    Low Pass: Low pass filter at the control b. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)

    ST

    Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).

    ISO-25

    25 kV Isolation: Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.

    ISO-40

    40 kV Isolation: Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

    ISO-80

    80 kV Isolation: Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

    ISO-120

    120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

    I-PC

    Integrated Part Components: Integration of small part components according to customer鈥檚 specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers).(2)

    I-FWD

    Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.

    LS-C

    LEMO socket for Control Connection: Input Z=100惟. An assembled bage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)

    PT-C

    Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins, which must be replaced by pigtails in case of any cooling option except option ITC.

    PIN-C

    Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.

    PT-HV

    Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.

    ST-HV

    Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

    SEP-C

    Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.

    FOI-C

    Fibre Optics Input / Control: Additional optical control b to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)

    FOO-F

    Fibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2)

    UL94

    Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

    FH Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.

    TH

    Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)

    FC

    Flat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with cooling options CF, GCF and DLC.

    ITC

    Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

    CF

    Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.

    CF-1

    Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).

    CF-X2

    Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

    CF-X3

    Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

    CF-CS

    Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power.

    CF-LC

    Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S.

    CF-D

    Double Copper Cooling Fins: Approx. more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS.

    CF-S

    Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS.

    CF-GRA

    Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.

    CF-CER

    Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.

    CCS

    Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.

    CCF

    Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated bl frame for unib and safe contact pressure. Max. 40 kVDC isolation.

    C-DR

    Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)

    GCF

    Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance. In combination with option SPT-C only.

    GCF-X2

    Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance 鈥淪witch to Flange鈥� reduced for twice the power capability. (2)

    ILC

    Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.

    DLC

    Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.

    HI-REL

    High Reliability / MIL Versions: Available on request. (2)


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