安裝便捷 1756-IT6I 變頻器冗余模塊
1762-IR4 | 1766-L32AWA | 1769-HSC | 1771-CFMK | 1784-U2DHP |
1762-IT4 | 1766-L32AWAA | 1769-IA16 | 1771-HD | 1784-U2DN |
1762-L24AWA | 1766-L32BWA | 1769-IA8I | 1771-HDP | 1785-ENET |
1762-L24AWAR | 1766-L32BWAA | 1769-IF16C | 1771-HODS | 1785-L20B |
1762-L24BWA | 1766-L32BXB | 1769-IF16V | 1771-HRA | 1785-L20E |
1762-L24BWAR | 1766-L32BXBA | 1769-IF4 | 1771-HS3A | 1785-L40B |
1762-L24BXB | 1766-MM1 | 1769-IF4I | 1771-HS3CR | 1785-L40C |
1762-L24BXBR | 1768-CNB | 1769-IF8 | 1771-HSAR | 1785-L40C15 |
1762-L40AWA | 1768-CNBR | 1769-IG16 | 1771-HSARS | 1785-L40E |
1762-L40AWAR | 1768-ENBT | 1769-IM12 | 1771-HSN | 1785-L60B |
1762-L40BWA | 1768-EWEB | 1769-IQ16 | 1771-HT | 1785-L60L |
1762-L40BWAR | 1768-KY1 | 1769-IQ16F | 1771-HT3 | 1785-L80B |
1762-L40BXB | 1768-L43 | 1769-IQ32 | 1771-HTE | 1785-L80C |
1762-L40BXBR | 1768-L43S | 1769-IQ32T | 1771-HTT | 1785-L80C15 |
1762-OA8 | 1768-L45 | 1769-IR6 | 1771-IA | 1785-L80E |
安裝便捷 1756-IT6I 變頻器冗余模塊
Digital Twin Consortium and OPC Foundation Announce Liaison Agreement
數(shù)字孿生聯(lián)盟和OPC會宣布簽署聯(lián)絡(luò)協(xié)議
Feb.6, 2023 - Today at the ARC Forum 2023, Digital Twin Consortium (DTC) and OPC Foundation announced a liaison agreement to accelerate the development and adoption of digital twin-enabling technologies. The DTC and the OPC Foundation have worked closely in several open-source reference implementation projects on GitHub and have agreed to collaborate even closer.
2023年2月6日 - 今天,在ARC2023論壇上,數(shù)字孿生聯(lián)盟(DTC)和OPC會宣布了一項聯(lián)絡(luò)協(xié)議,以加速數(shù)字孿生技術(shù)的開發(fā)和采用。數(shù)字孿生聯(lián)盟和OPC會在GitHub上的幾個開源參考實施項目中進行了密切合作,并同意進行更密切的合作。
“We are excited about working with OPC Foundation,” said Dan Isaacs, GM, and CTO of DTC. "Through our collaboration, we will influence interoperability standards and processes that will advance the use of digital twins in manufacturing across many industries.”
“我們很高興與OPC會合作,”數(shù)字孿生聯(lián)盟總經(jīng)理兼技術(shù)官Dan Isaacs說。“通過我們的合作,我們將影響互操作性標準和流程,從而推動數(shù)字孿生在許多行業(yè)制造中的使用?!?br />
The DTC and OPC Foundation have agreed to the following activities:
·Collaborating on standardization requirements
·Realizing interoperability by harmonizing technology components and other elements
·Aligning work in horizontal domains for adoption in vertical domains and use cases, proof of concepts, and Value Innovation Platbs (VIP) programs, including:
Technology, terminology, and taxonomy
Security and trustworthiness
Conceptual, inbational, structural, and behavioral models
Enabling technologies, such as simulation and AI
Technology stack across the digital twin lifecycle
Case study development
·Developing and understanding open-source reference implementations
安裝便捷 1756-IT6I 變頻器冗余模塊