執(zhí)行器IC20-07Q2T芯科技，芯創(chuàng)新；88202328
如果將上焊縫連同墊板一起撇出去，勢必要增大射線的傾斜角度，從而使縱向裂紋的檢出率降低。對于D≤1mm的固定口，一般只加不銹鋼墊板。如果按照常規(guī)進行雙壁雙投影透照，使上下焊縫在底片上呈橢圓顯示，開口間隙保持與焊縫寬度相當,同樣也存在縱向缺陷檢出率低問題。更為嚴重的是由于被檢管子焊縫的直徑較小，上、下兩個不銹鋼墊板在底片上的影像重疊更多，再加上小徑管本身壁厚就薄，鋁合金的厚度相對于不銹鋼折算厚度不足為慮，致使底片上的焊縫影像很淡，難以進行缺陷評定。
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BALLUFF INDUCTIVE SENSOR RPTA 1803-PU-03 *NEW IN BAG*
BALLUFF PROXIMITY SENSOR BES516-3017 BES5163017 E4-C-PU 10-30 V DC 150mA
BALLUFF PROXIMITY SENSOR BES516-3017 BES5163017 E4-C-PU 10-30 V DC 150mA
Balluff Photoelectric Emitter BLS 65K-1-G50-1
Balluff BTL5-M-2814-1S Transducer BTL5M28141S
alluff BTL5-M-2814-1S Transducer BTL5M28141S
Balluff BCSM18KM3-PSC80G-S04G Cap Active 24Vdc Proximity Switch BCSM18KM3 - USED
Balluff BCSM18KM3-PSC80G-S04G Cap Active 24Vdc Proximity Switch BCSM18KM3 - USED
BALLUFF INDUKTIVSENSOR BES 516-370-G-ES-Y-S49 OVP
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1 NIB BALLUFF BLS-18K-XX-1J-B1-L2 BLS18KXX1JB1L2 PROXIMITY SWITCH
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BALLUFF BOS 18M-WO-7RB-BO-L PHOTOELECTRIC SENSOR 20-50VAC 45-65HZ
BALLUFF M12 2MM PROXIMITY SENSOR, RXT-1202-PU1 *NEW*
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Balluff BES-516-209-S21-E Sensors
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MIDAS測定給出了宏觀夾雜物的數(shù)量和分布。對于高級扁平材，如DW超低碳鋼和IF鋼等，在不考慮鑄坯內(nèi)夾雜物類型、形態(tài)、尺寸和位置時，這個系統(tǒng)是有效的。夾雜物帶只在鑄坯離開垂直區(qū)后才形成，夾雜物聚集在一起，有清晰的輪廓。氣體保護系統(tǒng)用在了連鑄機上，可將二次氧化降到或完全消除。今天我們使用大型中間包，因為其鋼水存留時間長，夾雜物有足夠的時間上浮分離。對鋼水內(nèi)夾雜物的頻譜研究表明，尤其是在中間包和結(jié)晶器內(nèi)，已除掉了較大的夾雜物。
『鴻飛達自動化』
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