FV-L500B1
Used for the inspection of displays, solder defects and high precision flaw detection of semiconductors, liquid crystal and plasma flat panel displays, circuit boards, etc.
Exposure-interval signal output—which can start the next exposure during the transfer of the previous image—makes it possible to achieve high-speed work inspection*, thereby raising inspection efficiency. In addition, since the camera exposure interval is output externally, it can be used for various purposes.
FV-L200B1
Handles a wide range of inspection uses, such as bing prior to liquid crystal glass processing, circuit board mounted component checks and mounting inspection, automotive component flaw detection, medicine tablet inspection, etc.
Incorporating a strobe signal output (LVCMOS level) function for light emission use. With this function, it is possible for the user to adjust the camera exposure timing (delay, time) and light emission timing (delay, time) in accordance with the trigger b signal received by the camera.
FV-L030B1
Suitable for uses such as component alignment, bing, simple direction determination before component processing, taping and mounted device part presence/absence confirmation, etc.
On a camera with pre-processing functions, it is possible to correct luminance at all gradients using an on-board lookup table prepared by the user based on subject characteristics and inspection bives. This also reduces the burden on the PC’s CPU and increases processing speed. In addition, the lookup table can be prepared as a CSV file and uploaded.