IC697CPM924 plc
對(duì)于電路板上帶有電池的芯片不要輕易將其從板上拆下來.
二.復(fù)位電路
1.待修電路板上有大規(guī)模集成電路時(shí),應(yīng)注意復(fù)位問題.
2.在測(cè)試前裝回設(shè)備上,反復(fù)開,關(guān)機(jī)器試一試.以及多按幾次復(fù)
位鍵.
三.功能與參數(shù)測(cè)試
1.<測(cè)試儀>對(duì)器件的檢測(cè),僅能反應(yīng)出截止區(qū),放大區(qū)和飽和區(qū).但不
能測(cè)出工作頻率的高低和速度的快慢等具體數(shù)值等.
2.同理對(duì)TTL數(shù)字芯片而言,也只能知道有高低電平的輸出變化.而無
法查出它的上升與下降沿的速度.
四.晶體振蕩器
1.通常只能用示波器(晶振需加電)或頻率計(jì)測(cè)試,萬用表等無法測(cè)量,
否則只能采用代換法了.
2.晶振常見故障有:a.內(nèi)部漏電,b.內(nèi)部開路c.變質(zhì)頻偏d.外圍相連電
容漏電.這里漏電現(xiàn)象,用<測(cè)試儀>的VI曲線應(yīng)能測(cè)出.
3.整板測(cè)試時(shí)可采用兩種判斷方法:a.測(cè)試時(shí)晶振附近既周圍的有關(guān)
芯片不通過.b.除晶振外沒找到其它故障點(diǎn).
4.晶振常見有2種:a.兩腳.b.四腳,其中第2腳是加電源的,注意不可隨
意短路.
五.故障現(xiàn)象的分布
1.電路板故障部位的不完全統(tǒng)計(jì):1)芯片損壞30%, 2)分立元件損壞30%,
3)連線(PCB板敷銅線)斷裂30%, 4)程序破壞或丟失10%(有上升趨勢(shì)).
2.由上可知,當(dāng)待修電路板出現(xiàn)聯(lián)線和程序有問題時(shí),又沒有好板子,既
不熟悉它的連線,找不到原程序.此板修好的可能性就不大了.
IC697CPM924 plc
| 2711P-B10C10D2 | 2711P-B6M3D | |
| 2711P-B10C10D6 | 2711P-B6M5A | |
| 2711P-B10C15A2 | 2711P-B6M5A8 | |
| 2711P-B10C15D7 | 2711P-B6M5D | |
| 2711P-B10C1D2 | 2711P-B6M8A | |
| 2711P-B10C1D6 | 2711P-B6M8D | |
| 2711P-B10C4A2 | 2711P-B7C10D2 | |
| 2711P-B10C4A8 | 2711P-B7C10D6 | |
| 2711P-B10C4A9 | 2711P-B7C15A2 | |
| 2711P-B10C4D2 | 2711P-B7C1D2 | |
| 2711P-B10C4D8 | 2711P-B7C1D6 | |
| 2711P-B10C4D9 | 2711P-B7C4A8 | |
| 2711P-B12C10D2 | 2711P-B7C4A9 | |
| 2711P-B12C10D6 | 2711P-B7C4D8 | |
| 2711P-B12C1D2 | 2711P-B7C4D9 | |
| 2711P-B12C1D6 | 2711P-B7C6A1 | |
| 2711P-B12C4A6 | 2711P-K10C4A8 | |
| 2711P-B12C4A8 | 2711P-K10C4A9 | |
Bitmap![2O{4DB3SW)0S{W8T9C%F]}2](file://C:/Users/ADMINI~1/AppData/Local/Temp/msohtmlclip1/01/clip_image002.gif){kind=small}
|
2711P-K10C4D1 | |
| 2711P-B12C4D1 | 2711P-K10C4D2 | |
| 2711P-B12C4D6 | 2711P-K10C4D6 | |
| 2711P-B12C4D8 | 2711P-K10C4D8 | |
| 2711P-B12C4D9 | 2711P-K10C4D9 |
合作可以進(jìn)一步延伸到價(jià)值鏈，直到產(chǎn)品的生命周期結(jié)束，從而實(shí)現(xiàn)循環(huán)。選擇更堅(jiān)固的材料意味著它可以重復(fù)使用;更強(qiáng)的部件可能更難制造，因?yàn)槠湫枰吣芰棵芗墓に?，這些需要決策的變量使得數(shù)字化和仿真在今天格外重要 —— 簡(jiǎn)單的決策可以自動(dòng)化，復(fù)雜的決策可以依靠集體智慧。
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