以太網(wǎng)模塊 1734-OB2EP
.功能與參數(shù)測試
1.<測試儀>對器件的檢測,僅能反應(yīng)出截止區(qū),放大區(qū)和飽和區(qū).但不
能測出工作頻率的高低和速度的快慢等具體數(shù)值等.
2.同理對TTL數(shù)字芯片而言,也只能知道有高低電平的輸出變化.而無
法查出它的上升與下降沿的速度.
四.晶體振蕩器
1.通常只能用示波器(晶振需加電)或頻率計測試,萬用表等無法測量,
否則只能采用代換法了.
2.晶振常見故障有:a.內(nèi)部漏電,b.內(nèi)部開路c.變質(zhì)頻偏d.外圍相連電
容漏電.這里漏電現(xiàn)象,用<測試儀>的VI曲線應(yīng)能測出.
3.整板測試時可采用兩種判斷方法:a.測試時晶振附近既周圍的有關(guān)
芯片不通過.b.除晶振外沒找到其它故障點.
4.晶振常見有2種:a.兩腳.b.四腳,其中第2腳是加電源的,注意不可隨
意短路.
五.故障現(xiàn)象的分布
1.電路板故障部位的不完全統(tǒng)計:1)芯片損壞30%, 2)分立元件損壞30%,
3)連線(PCB板敷銅線)斷裂30%, 4)程序破壞或丟失10%(有上升趨勢).
2.由上可知,當待修電路板出現(xiàn)聯(lián)線和程序有問題時,又沒有好板子,既
不熟悉它的連線,找不到原程序.此板修好的可能性就不大了.
以太網(wǎng)模塊 1734-OB2EP
| 1734-232ASC |
| 1734-485ASC |
| 1734-ACNR |
| 1734-ADN |
| 1734-AENT |
| 1734-AENTR |
| 1734-APB |
| 1734-ARM |
| 1734-CTM |
| 1734-EP24DC |
| 1734-FPD |
| 1734-IA2 |
| 1734-IA4 |
| 1734-IB2 |
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| 1734-IB4D |
| 1734-IB8 |
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| 1734-IE2C |
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| 1734-IE8C |
| 1734-IJ |
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| 1734-OA2 |
| 1734-OA4 |
| 1734-OB2 |
| 1734-OB2E |
| 1734-OB2EP |
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| 1734-OB8 |
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| 1734-VTM |
| 1746-A13 |
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| 1747-SDN |
在西門子和卓能看來，實現(xiàn)破題需要達成兩個“關(guān)鍵”：其一，政策利好吸引更多“玩家”入場，行業(yè)競爭愈發(fā)激烈，產(chǎn)品差異化、高端化成為擺脫價格戰(zhàn)的關(guān)鍵；其二，行業(yè)終端和消費終端對紙袋的需求日趨多元化、個性化。紙袋機需要兼顧生產(chǎn)效率、穩(wěn)定性、易操作性、低碳環(huán)保、柔性化生產(chǎn)、個性化定制……將領(lǐng)先的數(shù)字化、運動控制技術(shù)引入制造流程是滿足市場需求的關(guān)鍵。
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