| 詳細(xì)參數(shù) | |||
|---|---|---|---|
| 品牌 | GE | 型號(hào) | DS200DCFBG1BGB |
| 結(jié)構(gòu)形式 | 模塊式 | 安裝方式 | 控制室安裝 |
| LD指令處理器 | 硬PLC | 功能 | I/O模擬控制板, |
| 工作電壓 | 24VDC | 輸出頻率 | 50/60赫茲 |
| 處理速度 | 500MHzPowerPC | 數(shù)據(jù)容量 | 120KB |
| 產(chǎn)品認(rèn)證 | UL | 環(huán)境溫度 | 0°C至70°C |
| 環(huán)境濕度 | 20%至80%,無冷凝 | 加工定制 | 否 |
| 重量 | 0.32斤 | 產(chǎn)地 | 美國 |
GE DS200DCFBG1BGB
DS200DCFBG1BGB 技術(shù)規(guī)格
制造商 GE通用電氣
零件號(hào) DS200DCFBG1BGB
產(chǎn)品類別 TC2000 模擬量 I/O 模塊
系列 馬克五世
GE I/O TC2000 模擬板DS200DCFBG1BGB 具有一個(gè) 80196 微處理器和多個(gè)可編程只讀存儲(chǔ)器 (PROM) 模塊。DS200DCFBG1BGB還包含一個(gè) LED 和 2 個(gè) 50 針連接器。從DS200DCFBG1BGB電路板的側(cè)視圖可以看到 LED。50 針連接器的 ID 是 JCC 和 JDD。GE I/O TC2000 模擬板 DS200TCCAG1BAA 上的 PROM 模塊存儲(chǔ)微處理器和可編程邏輯設(shè)備使用的指令和固件。信息嵌入在 PROM 中，可以擦除，更新版本存儲(chǔ)在 PROM 中。
PROM 模塊可從集成在板上的插槽中移除。要卸下 PROM 模塊，將一字螺絲刀插入模塊的一端下方，然后輕輕提起螺絲刀，模塊將彈出。然后，將螺絲刀插入模塊的另一端并執(zhí)行相同的操作。立即將模塊放入靜電保護(hù)袋中。
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